JPH0520878B2 - - Google Patents

Info

Publication number
JPH0520878B2
JPH0520878B2 JP21844087A JP21844087A JPH0520878B2 JP H0520878 B2 JPH0520878 B2 JP H0520878B2 JP 21844087 A JP21844087 A JP 21844087A JP 21844087 A JP21844087 A JP 21844087A JP H0520878 B2 JPH0520878 B2 JP H0520878B2
Authority
JP
Japan
Prior art keywords
core tube
furnace core
furnace
rod
shaped support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP21844087A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6460988A (en
Inventor
Jusuke Muraoka
Takamasa Sakai
Keiji Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP21844087A priority Critical patent/JPS6460988A/ja
Priority to US07/159,404 priority patent/US4849608A/en
Publication of JPS6460988A publication Critical patent/JPS6460988A/ja
Publication of JPH0520878B2 publication Critical patent/JPH0520878B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Resistance Heating (AREA)
  • Furnace Details (AREA)
JP21844087A 1987-02-14 1987-08-31 Heat treatment furnace for semiconductor substrate Granted JPS6460988A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP21844087A JPS6460988A (en) 1987-08-31 1987-08-31 Heat treatment furnace for semiconductor substrate
US07/159,404 US4849608A (en) 1987-02-14 1988-02-11 Apparatus for heat-treating wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21844087A JPS6460988A (en) 1987-08-31 1987-08-31 Heat treatment furnace for semiconductor substrate

Publications (2)

Publication Number Publication Date
JPS6460988A JPS6460988A (en) 1989-03-08
JPH0520878B2 true JPH0520878B2 (en]) 1993-03-22

Family

ID=16719946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21844087A Granted JPS6460988A (en) 1987-02-14 1987-08-31 Heat treatment furnace for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS6460988A (en])

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6807220B1 (en) * 2003-05-23 2004-10-19 Mrl Industries Retention mechanism for heating coil of high temperature diffusion furnace
JP2006284077A (ja) * 2005-03-31 2006-10-19 Kumamoto Technology & Industry Foundation 熱輻射反射炉
CN101409962B (zh) 2007-10-10 2010-11-10 清华大学 面热光源及其制备方法
CN101400198B (zh) 2007-09-28 2010-09-29 北京富纳特创新科技有限公司 面热光源,其制备方法及应用其加热物体的方法
CN101636011B (zh) * 2008-07-25 2012-07-18 清华大学 空心热源
CN101636009B (zh) * 2008-07-25 2012-08-29 清华大学 空心热源的制备方法
CN101626641B (zh) * 2008-07-11 2015-04-01 清华大学 空心热源
CN101626642B (zh) * 2008-07-11 2011-06-22 清华大学 空心热源
CN101636010A (zh) * 2008-07-25 2010-01-27 清华大学 空心热源
CN101636002B (zh) * 2008-07-25 2012-03-14 清华大学 立体热源
CN101636001B (zh) * 2008-07-25 2016-01-20 清华大学 立体热源
WO2014073545A1 (ja) * 2012-11-06 2014-05-15 貞徳舎株式会社 電気ヒーター並びにこれを備えた加熱装置及び半導体製造装置
JP7501978B2 (ja) * 2020-06-05 2024-06-18 エルジー エナジー ソリューション リミテッド チューブモジュール及びそれを含むチューブ組立体

Also Published As

Publication number Publication date
JPS6460988A (en) 1989-03-08

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees