JPH0520878B2 - - Google Patents
Info
- Publication number
- JPH0520878B2 JPH0520878B2 JP21844087A JP21844087A JPH0520878B2 JP H0520878 B2 JPH0520878 B2 JP H0520878B2 JP 21844087 A JP21844087 A JP 21844087A JP 21844087 A JP21844087 A JP 21844087A JP H0520878 B2 JPH0520878 B2 JP H0520878B2
- Authority
- JP
- Japan
- Prior art keywords
- core tube
- furnace core
- furnace
- rod
- shaped support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 14
- 125000006850 spacer group Chemical group 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000005452 bending Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- -1 SiC Chemical compound 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Resistance Heating (AREA)
- Furnace Details (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21844087A JPS6460988A (en) | 1987-08-31 | 1987-08-31 | Heat treatment furnace for semiconductor substrate |
US07/159,404 US4849608A (en) | 1987-02-14 | 1988-02-11 | Apparatus for heat-treating wafers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21844087A JPS6460988A (en) | 1987-08-31 | 1987-08-31 | Heat treatment furnace for semiconductor substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6460988A JPS6460988A (en) | 1989-03-08 |
JPH0520878B2 true JPH0520878B2 (en]) | 1993-03-22 |
Family
ID=16719946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21844087A Granted JPS6460988A (en) | 1987-02-14 | 1987-08-31 | Heat treatment furnace for semiconductor substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6460988A (en]) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6807220B1 (en) * | 2003-05-23 | 2004-10-19 | Mrl Industries | Retention mechanism for heating coil of high temperature diffusion furnace |
JP2006284077A (ja) * | 2005-03-31 | 2006-10-19 | Kumamoto Technology & Industry Foundation | 熱輻射反射炉 |
CN101409962B (zh) | 2007-10-10 | 2010-11-10 | 清华大学 | 面热光源及其制备方法 |
CN101400198B (zh) | 2007-09-28 | 2010-09-29 | 北京富纳特创新科技有限公司 | 面热光源,其制备方法及应用其加热物体的方法 |
CN101636011B (zh) * | 2008-07-25 | 2012-07-18 | 清华大学 | 空心热源 |
CN101636009B (zh) * | 2008-07-25 | 2012-08-29 | 清华大学 | 空心热源的制备方法 |
CN101626641B (zh) * | 2008-07-11 | 2015-04-01 | 清华大学 | 空心热源 |
CN101626642B (zh) * | 2008-07-11 | 2011-06-22 | 清华大学 | 空心热源 |
CN101636010A (zh) * | 2008-07-25 | 2010-01-27 | 清华大学 | 空心热源 |
CN101636002B (zh) * | 2008-07-25 | 2012-03-14 | 清华大学 | 立体热源 |
CN101636001B (zh) * | 2008-07-25 | 2016-01-20 | 清华大学 | 立体热源 |
WO2014073545A1 (ja) * | 2012-11-06 | 2014-05-15 | 貞徳舎株式会社 | 電気ヒーター並びにこれを備えた加熱装置及び半導体製造装置 |
JP7501978B2 (ja) * | 2020-06-05 | 2024-06-18 | エルジー エナジー ソリューション リミテッド | チューブモジュール及びそれを含むチューブ組立体 |
-
1987
- 1987-08-31 JP JP21844087A patent/JPS6460988A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6460988A (en) | 1989-03-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0520878B2 (en]) | ||
JP3479020B2 (ja) | 熱処理装置 | |
US4849608A (en) | Apparatus for heat-treating wafers | |
JPH10233277A (ja) | 熱処理装置 | |
JPS63199414A (ja) | 基板の熱処理装置 | |
JPH04101419A (ja) | 基板の熱処理炉 | |
KR20190098536A (ko) | 진공 증발원용 히터 및 절연체 어셈블리 | |
JPS6341753Y2 (en]) | ||
JPS6342524Y2 (en]) | ||
JPS581992Y2 (ja) | 熱反射形拡散炉のヒ−タ保持装置 | |
JPH0722137B2 (ja) | 半導体基板の熱処理炉 | |
JPH03771B2 (en]) | ||
JPH0718447A (ja) | 熱処理装置 | |
JPH0554690B2 (en]) | ||
JPH0712039B2 (ja) | 熱処理装置 | |
JPS638128Y2 (en]) | ||
JPS62260317A (ja) | 半導体ウエハの熱処理装置 | |
JPS6339962Y2 (en]) | ||
JP2004071619A (ja) | 基板処理装置 | |
JPS61164220A (ja) | 熱処理炉 | |
JPH04116129U (ja) | 基板熱処理炉 | |
CN118099024A (zh) | 基板热处理用板状加热器 | |
KR100643661B1 (ko) | 열처리 장치의 히터 어셈블리 및 그 제조 방법 | |
JPH076973A (ja) | 加熱装置 | |
JPH05248770A (ja) | 加熱炉 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |